VMAP International Conference on CAE Interoperability 2020
The 1st International Conference on Interoperability, organised by the VMAP project was an OnLine Conference that took place on 19th-20th October 2020 and had almost 550 registrations and 25 presentations.
All presentations titles and authors are listed below and the Conference agenda may be downloaded by clicking here.
VMAP related presentations may be viewed online, see titles (bold type) in list below.
We are now looking forward to the 2nd International Conference on CAE Interoperability that will be held in Spring 2022. Please note this in your agenda!
Interoperability is a significant topic for much of the Computer-Aided Engineering (CAE) simulation and analysis sector. Improving accuracy and speed in both product and process design is a constant requirement. A critical factor in this is enabling seamless collaboration between teams, often in different organisations, addressing different simulations and physics. This, however, presents a significant barrier.
The conference focussed on the many aspects, problems and possible solutions in interoperability including software implementation, simulation process integration, data transfer, standards, ontologies, and collaboration. This was the first independent, international gathering focussing solely on interoperability. We will arrange the second conference in Spring 2022 so please diarise this.
PRESENTATIONS (1st International Conference on Interoperability 2020)
Digital Thread to Capture and Exchange Content and Intent Across the Product Lifecycle – The Key to Effective Management of Ever-Increasing Product Complexity
M. Nicolich (ARAS)
Generative Design for Digital Fabrication
G .Sundar Dutta, J. Kottmann, L. Steuernagel, D. Meiners (Technical University Clausthal)
Sheet-Metal Manufacturing Simulations Coupled to Structural Simulations for an Improved Structural Static and Fatigue Response
N. Laue, A. Jensen (Grundfos Holding)
3D Deep-Learning Based Surrogate Modeling and Optimization
L. Zampiere, P. Baqué, S. Baset, T. Allard, T. von Tschammer (Neural Concept)
An Integrated Design-Process Optimization Methodology – With Two Industrial Cases
V. Tsai, F. Buchy (SimpaTec)
Minimizing the Weld Distortion by Optimizing the Weld Sequence Using Genetic Algorithm
D. Jeyaganesh (UAE University)
The eCl@ss Standard as Semantic Basis for CAE Product Data Exchange
C. Block (eCl@ss Head Office)
Tailored Data Exchange Processes in Automotive Bodywork Engineering
A. Kreis, M. Hirz (Graz University of Technology); M. Prenner, S. Stadler (Magna Steyr Fahrzeugtechnik)
Data Exchange and Software Interoperability Based on MOSSEC Standard. Application to a Cabin Aircraft Architecture Process
A. Munck, X. Dugros, D. Sauvage (Digital Product Simulation)
A Value-Focussed Approach to the Deployment of Simulation Data Management to Support Multidisciplinary Simulation and Interoperability
M. Norris (theSDMconsultancy); G. Neveu (DPS)
An Approach Towards Interoperability of CSM Models in the Virtual Structural Sizing and Testing of Lightweight Composite Structures
M. Rädel (German Aerospace Center DLR)
Digital Twins in Technical Product Development: Definitions and Insights from an Industrial Case Study
J. Trauer, S. Schweigert-Recksiek, M. Zimmermann (Technical University of Munich); C. Engel, K. Spreitzer (Viessmann)
Enhanced Simulation of Shrinkage and Warpage of Extrusion Blow Molded Parts Using the VMAP Interface Standard.
O. Bruch (Dr. Reinold Hagen Stiftung/ TREE Institut); P. Michels, (Dr. Reinold Hagen Stiftung); D. Grotenburg (RIKUTEC Engineering)
… click to see video
Interoperability in Multiphysical Development Processes
D. Friedemann, J. Rademann (HTW Berlin); B. Näser (BMW Group)
Mapping of Microstructure Information to FE-Meshes by Means of Computed Tomography
B. Lauterbach, P. Pinter (Volume Graphics)
Qualitative Study for Energy Consumption of Domestic Appliances
A. Naiknawarea, S. Sahoo, J. Chhatre, A. Shukla (Whirlpool)
How ICME Enables Microstructure as a Design Parameter for Optimal Plastic Components
P. Hebert, B. Alsteens (e-Xstream engineering, part of Hexagon Manufacturing Intelligence division)
Omnis – Gateway to Exchange Data Betweens Tools
Y. Baux. M. Pottiez, O. Arduini, V. Sotiaux (Numeca International)
Attendance was free since this was an Online Conference and the VMAP project was able to subsidise all participants (experts, engineers, developers and practitioners in the field).